Title:
SOLID STATE RELAY AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH07106629
Kind Code:
A
Abstract:
PURPOSE: To provide a transfer molded solid state relay in which the number of components is decreased by mounting a power control semiconductor element and various electronic components on a lead frame.
CONSTITUTION: The solid state relay.comprises a lead frame 2, a triac chip 4, a solid state relay 3 for firing, a resistor 8, and a capacitor 9 wherein the triac chip 4, the solid state relay 3, the resistor 8 and the capacitor 9 are solderable and mounted on the lead frame 2 before they are sealed by transfer molding.
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Inventors:
FUJIWARA SUSUMU
Application Number:
JP24341593A
Publication Date:
April 21, 1995
Filing Date:
September 30, 1993
Export Citation:
Assignee:
SHARP KK
International Classes:
H01L31/12; H03K17/78; (IPC1-7): H01L31/12
Attorney, Agent or Firm:
Umeda Masaru
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