PURPOSE: To provide a cooling structure which uniformly cools printed boards housed in each shelf, where the shelves where printed boards are housed in parallel respectively are stacked up in layers in a rack in a forced-air cooling type electronic equipment.

CONSTITUTION: An air intake-exhaust unit 5, a lower shelf 10-2, an upper shelf 10-1, and a fan unit 2 are successively stacked up in layers in a rack 1 from below toward a top in an air-forced cooling type electronic equipment, where printed boards 15 mounted in parallel in each shelf are air-forced cooled. Components of high heat release value are mounted on the front side of the printed board 15 mounted in the lower shelf 10-2, and air intake vents 20 are provided to the a front plate 18 or a separate front plate which blocks the opening of the lower shelf 10-2 corresponding to the component of high heat release value.