PURPOSE: To realize a hybrid integrated circuit having a high quality at a low cost by pressing a contact member into a resin molding frame to form an integrated lead terminal.
CONSTITUTION: Four pieces A, B, C, D are connected to form an integrated square resin molding frame 2 by transfer-molding the heat resistant resin. A contact member 3, which is formed accurately by etching and pressing, is pressed for holding at a predetermined position of the sides A, C. A lead terminal 1, in which the pitch accuracy P of each lead terminal 3a 3b is maintained and the positional dispersion of the lead terminal 3a, 3c is maintained at 0, is thereby molded. This lead terminal 1 is bonded to an input and output electrode conductor 4b by a bonding member such as solder at a predetermined position of a mounted substrate 7. Shape accuracy such as displacement of a lead terminal and pitch is thereby secured, and non-alignment phenomenon of the lead terminal at the time of reflow is prevented to restrict the open malfunction of a soldered part.
OKUMURA ITARU
OTSUKI KAZUHIKO
WADA MITSUNORI
