Title:
【発明の名称】半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP2534667
Kind Code:
B2
Inventors:
OOYA SHUICHI
SEKYA KYOZO
SEKYA KYOZO
Application Number:
JP9070386A
Publication Date:
September 18, 1996
Filing Date:
April 18, 1986
Export Citation:
Assignee:
NIPPON ELECTRIC CO
International Classes:
H01L21/8238; H01L21/28; H01L21/3205; H01L21/336; H01L21/44; H01L21/8234; H01L27/088; H01L27/092; H01L29/78; (IPC1-7): H01L21/8234; H01L21/28; H01L21/3205; H01L21/336; H01L21/8238; H01L27/088; H01L27/092; H01L29/78
Domestic Patent References:
| JP5583268A | ||||
| JP57196573A | ||||
| JP56111264A | ||||
| JP60123056A | ||||
| JP59125661A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)