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Title:
【発明の名称】半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP3376239
Kind Code:
B2
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Inventors:
Masaya Kubota
Kazuhiko Ohashi
Kimio Maruyama
Seiichi Goya
Application Number:
JP6028797A
Publication Date:
February 10, 2003
Filing Date:
March 14, 1997
Export Citation:
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Assignee:
Toshiba Microelectronics Corporation
Toshiba Corporation
International Classes:
H05K9/00; H01L21/301; H01L21/3205; H01L21/822; H01L23/52; H01L27/04; (IPC1-7): H01L21/3205; H01L21/301; H01L21/822; H01L27/04
Domestic Patent References:
JP5730344A
JP4179126A
JP6318597A
Attorney, Agent or Firm:
Norio Ogo (1 outside)



 
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