Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH0770675
Kind Code:
A
Abstract:
PURPOSE: To obtain a high reliability semiconductor device by using a Cu-based bonding wire having a specified compsn. when a semiconductor chip is electrically connected to a lead finger.
CONSTITUTION: The compsn. of a bonding wire is composed of 0.1-0.2wt.% two or more kinds of elements selected from among Be, Sn, Zn, Zr, Ag, Cr and Fe (1st group of additive elements), 0.001-2wt.% one or more kinds of elements selected from among Mg, Ca, rare earth elements, Ti, Hf, V, Nb, Ta, Ni, Pd, Pt, Au, Cd, B, In, Si, Ge, Pb, P, Sb, Bi, Se and Te (2nd group of additive elements) and the balance essentially Cu.
Inventors:
YAMANE SHIGEMI
ATSUMI KOICHIRO
ANDO TETSUO
YAGI NORIAKI
ATSUMI KOICHIRO
ANDO TETSUO
YAGI NORIAKI
Application Number:
JP17965394A
Publication Date:
March 14, 1995
Filing Date:
July 08, 1994
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
H01B1/02; H01L21/60; C22C9/00; (IPC1-7): C22C9/00; H01B1/02; H01L21/60
Domestic Patent References:
| JPS57149744A | 1982-09-16 | |||
| JPS59139662A | 1984-08-10 |
Attorney, Agent or Firm:
Noriyuki Noriyuki
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