Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JP2615972
Kind Code:
B2
Abstract:
PURPOSE:To reduce heat resistance while reducing poor sealing by sticking a radiating member to a flat surface consisting of the rear of a semiconductor element and the raised part surface of a car. CONSTITUTION:When a semiconductor element 31 is bonded and the peripheral part 33b of a cap 33 is stuck to a substrate 32, and outline of the semiconductor element 31 is accorded with an opening 33c of the cap, the rear 31b of the semiconductor element 31 is shown to the opening 33c of the cap so that the surface of the raised part 33a of the cap 33 and the back 31b of the semiconductor element 31 form a flat surface. Next, the underside 34b of a heat sink 34 and the flat face consisting of the surface of the raised part 33a of aforesaid cap 33 and the rear 31b of the semiconductor element 31 are adhered by melting by means of a wax material 60 for airtight sealing. By a construction like this, the whole of the rear 31b of the semiconductor element 31 is stuck to the underside 34b of the heat sink 34 on the flat face to improve heat radiation while having little outflow of a wax material 36 and being able to visualize a flat adhesive face and to decrease poor sealing.
Inventors:
Atsushi Shimizu
Tsujimura Takehisa
Masahiro Sugimoto
Shigeki Harada
Tsujimura Takehisa
Masahiro Sugimoto
Shigeki Harada
Application Number:
JP3233989A
Publication Date:
June 04, 1997
Filing Date:
February 10, 1989
Export Citation:
Assignee:
富士通株式会社
International Classes:
H01L23/40; (IPC1-7): H01L23/40
Domestic Patent References:
| JP58225656A | ||||
| JP60213048A | ||||
| JP6380553A | ||||
| JP6373650A | ||||
| JP5892241A |
Attorney, Agent or Firm:
Teiichi