Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JP2687752
Kind Code:
B2
Inventors:
Yoshinobu Masanobu
Application Number:
JP8279391A
Publication Date:
December 08, 1997
Filing Date:
April 16, 1991
Export Citation:
Assignee:
NEC
International Classes:
H01L21/318; H01L21/822; H01L27/04; (IPC1-7): H01L27/04; H01L21/318; H01L21/822
Domestic Patent References:
| JP59231822A | ||||
| JP63237456A | ||||
| JP2159069A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)