Title:
【発明の名称】半導体集積回路装置
Document Type and Number:
Japanese Patent JP2596246
Kind Code:
B2
Inventors:
Keiji Miura
Application Number:
JP7351991A
Publication Date:
April 02, 1997
Filing Date:
April 08, 1991
Export Citation:
Assignee:
NEC
International Classes:
H01L21/60; H01L21/82; H01L27/118; (IPC1-7): H01L21/60; H01L21/82; H01L27/118
Domestic Patent References:
| JP2251157A | ||||
| JP3278551A | ||||
| JP2168638A | ||||
| JP3238840A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)