Title:
【発明の名称】半導体集積回路
Document Type and Number:
Japanese Patent JP3157187
Kind Code:
B2
Inventors:
Shigeru Iwano
Toshiaki Imai
Toshiaki Imai
Application Number:
JP12390291A
Publication Date:
April 16, 2001
Filing Date:
May 28, 1991
Export Citation:
Assignee:
Sanyo Electric Co., Ltd.
International Classes:
H01L27/04; H01L21/331; H01L21/822; H01L21/8222; H01L27/06; H01L29/73; H01L29/732; (IPC1-7): H01L21/8222; H01L27/04; H01L29/73
Domestic Patent References:
| JP1133354A | ||||
| JP1133348A | ||||
| JP6113656A | ||||
| JP5954257A | ||||
| JP58159367A | ||||
| JP5656681A | ||||
| JP60166155U |
Attorney, Agent or Firm:
Masamasa Shibano