Title:
【発明の名称】熱圧着ボンデイング部材及びその製造方法
Document Type and Number:
Japanese Patent JP2533227
Kind Code:
B2
Abstract:
A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough surface morphology having ridges with approximately 1 micrometer modulation frequency and a depth between ridges of from 1/4 to 1/2 that of the average integrated circuit pad. The deformable layer is produced by plating gold in a strong electronegative plating bath within a range of 0.03 to 0.05 mA/sq.cm. current density. Plating apparatus, for plating different areas, with different electronegative conditions, with separate independently powered anodes, is provided.
Inventors:
SANGU KOON KANGU
MAIKERU JON PARUMAA
TEIMOSHIII KURAAKU REIREI
ROBAATO DEUIDO TOPA
MAIKERU JON PARUMAA
TEIMOSHIII KURAAKU REIREI
ROBAATO DEUIDO TOPA
Application Number:
JP21725990A
Publication Date:
September 11, 1996
Filing Date:
August 20, 1990
Export Citation:
Assignee:
INTAANASHONARU BIJINESU MASHIINZU CORP
International Classes:
B23K20/02; B23K20/233; B23K33/00; H01L21/60; H01L21/603; (IPC1-7): H01L21/603
Attorney, Agent or Firm:
Koichi Tonmiya (1 person outside)