PURPOSE: To detect the number of leads, the position, and lead bend in the horizontal direction and the vertical direction, without coming into contact with the lead part of an electronic component, and enable mounting, in the precess from the sucking of electronic components provided with leads to the mounting of them.
CONSTITUTION: A nozzle 17 for sucking an electronic component 14 provided with leads is installed at the tip of a head part 16 which moves on the XY plane. In the process that a sucked electronic component is mounted on a printed wiring board 20, the number of leads of the electronic components 14 provided with leads, the position, and lead bend in the horizontal direction are detected by a recognition part 18. Bend of leads in the vertical direction is detected by a lead bend detection part 19. After that, the component is mounted on the printed board 20.
UCHIDA KANJI
IKETANI KEIJI
SUEKI MAKOTO
UCHIDA HIDEKI
