Title:
【発明の名称】導電性樹脂成形体およびその製造方法
Document Type and Number:
Japanese Patent JP2508182
Kind Code:
B2
Abstract:
A conductive plastic molding obtained by melt molding an ethylene copolymer comprising from 40 to 90% by weight of an ethylene unit, from 10 to 60% by weight of at least one dialkylaminoalkylacrylamide comonomer unit represented by formula wherein R1 represents a hydrogen atom or a methyl group; R2 and R3 each represents an alkyl group having from 1 to 4 carbon atoms; and n represents an integer of from 2 to 5, and up to 20% by weight of one or more ethylenically unsaturated comonomer units and having a number average molecular weight of from 5,000 to 50,000 and impregnating at least 10 parts by weight of an aqueous solution of at least one of an organic acid, an inorganic acid, and an inorganic metal salt into 100 parts by weight of the resulting melt molded. The molding exhibits excellent conductivity and can be obtained easily and at low cost without any limitation on shape.
Inventors:
OOMAE TADAYUKI
SAKURAI MASA
YAMAGUCHI NOBORU
OKADA MITSUYUKI
ASAO KOICHIRO
SAKURAI MASA
YAMAGUCHI NOBORU
OKADA MITSUYUKI
ASAO KOICHIRO
Application Number:
JP9653188A
Publication Date:
June 19, 1996
Filing Date:
April 18, 1988
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO
International Classes:
C08J7/06; C08L33/04; C08L33/24; D01F8/06; C08J7/02; H01B1/12; H01B1/20; (IPC1-7): C08J7/06; C08L33/24; H01B1/20
Domestic Patent References:
| JP60173024A |
Attorney, Agent or Firm:
Mitsuhiro Moroishi (1 person outside)