PURPOSE: To obtain uniform gap and to facilitate sealing work for a semiconductor device by forming a projection on any of the four peripheral sides of a cap or inner peripheral sides of a chip carrier body opposed to the four sides.

CONSTITUTION: When a projection 19 which is equal to meniscus method on any of four peripheral sides of a cap 18 which is mounted on a chip carrier body 10 and the cap 18 is supported on the body 10, the projection 19 becomes a spacer, and an interval 20 is formed from the body. A sealing Au-Sn alloy or solder material 21 of glass is filled in the interval 20. According to this structure, the deflection of the cap to the body can be prevented, thereby preferably executing the sealing work.