PURPOSE: To perform a superior moisture-resistance sealing, with which the bonding property of a semiconductor element and connector wires is excellent, without applying stress to the element by a method wherein a silicone sealing compound, sol, is gelatinized with heat, and the semiconductor element and the connector wires are sealed with the silicone sealing compound.
CONSTITUTION: Metallized layers 5 are electrically connected to external pins 7 through holes 6 provided in a glass epoxy substrate 2. The pins 7 are numerously disposed in upright on the substrate 2 with solders 8 having a high melting point. A semiconductor element 1 is sealed with a silicone sealing compound 9 along with connector wires 4. As the sealing compound 9 is usually in the state of sol, the drift thereof is inhibited with dams 10 and is gelatinized by applying heat. At this time, stress to apply to the semiconductor element 1 can be done at a less degree and the bonding property of the semiconductor element 1 and the connector wires 4 is excellent, and moreover, a superior moisture-resistance sealing is performed. Out of the imperative necessity that the connector wires 4 and the semiconductor element 1 must be mechanically protected from external environments, a cap 11 is at least capped on the part sealed with gel.
OOTSUKA KANJI
HONDA ATSUSHI
SHIRAI MASAYUKI
YAMAZAKI YASUYUKI
NAKAMURA KOUJI
MORITAN TOSHIYUKI
USAMI TAMOTSU
HOSOSAKA HIROSHI
| JPS5420667U | 1979-02-09 | |||
| JPS516868U | 1976-01-19 | |||
| JPS56139253U | 1981-10-21 | |||
| JPS57184239A | 1982-11-12 | |||
| JPS57210645A | 1982-12-24 | |||
| JPS58159355A | 1983-09-21 | |||
| JPS5724554A | 1982-02-09 |
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