Title:
【発明の名称】微細な穴をあける方法
Document Type and Number:
Japanese Patent JP2003505247
Kind Code:
A
Abstract:
A method of producing microbore holes in a multi-layer substrate (5), preferably a printed circuit board substrate, that is displaced below writing optics (4) by an XY stage (6), using the optics to generate a spot from a light source (1), preferably a laser. The method reduces the treatment time and preferably compensates for distortions in the substrate material. To this end, the position of the spot within a working field is changed simultaneously with the treatment positions by electronically controlled, movable mirrors. The position of the substrate is determined by an interferometer (9, 11), and the signals corresponding to the substrate position are processed by a suitable computer system (16) to obtain an actual position of the table system. The computer system (16) is preferably provided with all bore hole coordinates and additional information such as bore hole diameter, especially in tabular form.
Inventors:
Fuogler, Suhuen
Kaplan, Roland
Kaplan, Roland
Application Number:
JP2001512059A
Publication Date:
February 12, 2003
Filing Date:
July 19, 2000
Export Citation:
Assignee:
Heidelberg Instruments Microtechnics GMB Her
International Classes:
B23K26/00; B23K26/04; B23K26/042; B23K26/06; B23K26/08; B23K26/382; B23K26/402; B23K26/70; H05K3/00; H05K1/02; (IPC1-7): B23K26/00; B23K26/02; B23K26/08
Attorney, Agent or Firm:
Yoshio Kawaguchi (5 outside)