Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP2906491
Kind Code:
B2
Inventors:
OGUCHI AKEMI
Application Number:
JP29461489A
Publication Date:
June 21, 1999
Filing Date:
November 13, 1989
Export Citation:
Assignee:
SEIKOO EPUSON KK
International Classes:
H01L21/28; H01L21/31; H01L21/316; H01L21/324; (IPC1-7): H01L21/28; H01L21/28; H01L21/316
Domestic Patent References:
| JP6262543A | ||||
| JP5229174A | ||||
| JP4825480A | ||||
| JP61212041A |
Attorney, Agent or Firm:
Kisaburo Suzuki (1 outside)