Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP2913936
Kind Code:
B2
Inventors:
NAKANO HIDEKAZU
Application Number:
JP26016691A
Publication Date:
June 28, 1999
Filing Date:
October 08, 1991
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
H01L21/302; H01L21/3065; H01L21/311; H01L21/768; (IPC1-7): H01L21/3065
Domestic Patent References:
| JP62263638A | ||||
| JP63272038A | ||||
| JP61114530A | ||||
| JP62204529A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)