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Title:
【発明の名称】半導体基板の鏡面研磨方法
Document Type and Number:
Japanese Patent JP2971714
Kind Code:
B2
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Inventors:
MATSUO HIROSHI
YOSHINO HISAFUMI
Application Number:
JP27000793A
Publication Date:
November 08, 1999
Filing Date:
October 01, 1993
Export Citation:
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Assignee:
SUMITOMO KINZOKU KOGYO KK
International Classes:
B24B1/00; B24B37/00; B24B57/02; H01L21/304; (IPC1-7): B24B1/00; B24B37/04; H01L21/304
Domestic Patent References:
JP366565A
JP512093A
JP557612A
JP63306881A
JP4193453A
JP463660A
JP2257627A
JP5368493A
JP224059A
JP57182810A
JP59847U
JP5648461U
JP6317649Y2
Attorney, Agent or Firm:
Yoshihisa Oshida



 
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