Title:
HEAT-RESISTANT SEMICONDUCTOR CHIP PACKAGE
Document Type and Number:
Japanese Patent JPH0621291
Kind Code:
A
Abstract:
PURPOSE: To improve the cooling efficiency of a chip module by laminating plural IC semiconductor chips so that the front faces can be faced to the back faces, or the front faces can be faced to the front faces, and circulating coolant between the chip modules. CONSTITUTION: A chip module 21 is formed of plural mutually connected semiconductor chips 22, and one face of the chip module 21 is connected with a base 23 by plural solder bumps 24. The base 23 including the solder bumps 24 and the chip module 21 form a space, the space is sealed, and an opening for circulating coolant is formed at the base 23. The coolant is allowed to inflow from the opening, and to run in the surrounding of the solder bumps 24 of the base 23 so that a coolant passage can be formed. Also, the coolant is allowed to flow through a clearance 29 between the solder bumps 24. This. efficient cooling can be executed.
Inventors:
KENESU EDOWAADO BAIRUSHIYUTAIN
KURAUDE RUISU BAATEIN
GOODON AASAA KERII JIYUNIA
KURISUTOFUAA POORU MIRAA
KURAUDE RUISU BAATEIN
GOODON AASAA KERII JIYUNIA
KURISUTOFUAA POORU MIRAA
Application Number:
JP4290893A
Publication Date:
January 28, 1994
Filing Date:
March 03, 1993
Export Citation:
Assignee:
IBM
International Classes:
H01L23/473; H01L25/00; H01L25/065; (IPC1-7): H01L23/473; H01L25/00
Attorney, Agent or Firm:
Koichi Tonmiya (4 outside)
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