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Title:
PRINTED BOARD SUPPORT
Document Type and Number:
Japanese Patent JPH0613772
Kind Code:
A
Abstract:

PURPOSE: To obtain a printed board support which possesses an electrical noise preventing effect making the best of the merit of synthetic resin by a method wherein all the surface or the necessary surface of the printed board support is plated through an electroless plating method.

CONSTITUTION: All the surface or the necessary surface of a printed board support 1 (20) of synthetic resin is plated with an electroless plating layer 40 through an electroless plating method, where the electroless plating layer 40 is composed of an electro1ess plating copper layer 41 as a base layer and an electroless nickel layer 42 laid on the copper layer 41. As the electroless plating layer 40 is 2 to 3μm in thickness, it hardly changes the printed board support 1 of synthetic resin in physical properties, and the electroless plating layer 40 is more uniform in thickness as compared with an electroplating layer, much lower in contact resistance than a conductive coating aluminum evaporation conductive plastic, and small and stable in resistance change. Therefore, the printed board support 1 (20) of synthetic resin can be kept high enough in electric noise preventing properties making the best of the merit of synthetic resin.


Inventors:
TAKEUCHI YASUICHI
Application Number:
JP20837392A
Publication Date:
January 21, 1994
Filing Date:
June 26, 1992
Export Citation:
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Assignee:
TAKEUCHI KOGYO KK
International Classes:
H05K7/04; H05K7/12; H05K7/14; H05K9/00; (IPC1-7): H05K7/14; H05K7/04; H05K7/12; H05K9/00



 
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