METHOD OF LASER TRIMMING ELEMENT ON SEMICONDUCTOR SUBSTRATE

Title:

METHOD OF LASER TRIMMING ELEMENT ON SEMICONDUCTOR SUBSTRATE

Document Type and Number:

Japanese Patent JPS58118

Kind Code:

A

Abstract:

A method of laser trimming thin film resistors on semiconductive substrates wherein the laser is set to a frequency equal to or less than Eg/h, where Eg is the optical band-gap energy of the doped semiconductor substrate, and h is Planck's constant.

Inventors:

JIEROOMU EFU RAFUAMU
TOMII DEI KURAAKU

Application Number:

JP9910082A

Publication Date:

January 05, 1983

Filing Date:

June 09, 1982

Export Citation:

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Assignee:

ANALOG DEVICES INC

International Classes:

H01C17/242; H01L21/302; H01L27/01; H01L27/14; (IPC1-7): H01C17/24; H01L21/26; H01L27/01; H01L27/04

Attorney, Agent or Firm:

Masaru Tsuchiya

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