Title:
FORMATION OF MICROSCOPIC PATTERN
Document Type and Number:
Japanese Patent JPS59126635
Kind Code:
A
Abstract:
PURPOSE:To improve the accuracy in pattern formation by a method wherein, after an organic film and the first metal film have been formed on a substrate, the first metal film is selectively removed by performing an etching, another etching is performed on the organic film, a film is formed thereon, and the organic film is removed. CONSTITUTION:A resist 2 is spin-coated on a silicon substrate 1, and the first metal film 3 is formed thereon. Then, the first metal film 3 is selectively removed by performing an etching using an ion beam 4. Subsequently, another etching is performed on the resist 2 using the first metal film 3 as a mask. The second metal film 5 is then formed by performing a vapor-deposition. Then, the resist 2 is removed by fusing.
Inventors:
MORIMOTO HIROAKI
KATOU TAKAAKI
KATOU TAKAAKI
Application Number:
JP207383A
Publication Date:
July 21, 1984
Filing Date:
January 08, 1983
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L21/302; H01L21/3065; (IPC1-7): H01L21/302
Attorney, Agent or Firm:
Masuo Oiwa