Title:
MICROSCOPIC BONDING METHOD
Document Type and Number:
Japanese Patent JPS6043837
Kind Code:
A
Abstract:
PURPOSE:To obtain an excellent junction of stabilized quality by a method wherein the contact heat resistance, which is the most important factor for stabilization of the quantity of heat to be given to the part to be jointed, is monitored directly, and the condition under which a junction work is performed is controlled in accordance with the result of said monitoring. CONSTITUTION:Before the current application and pressurization for junction are performed on an electrode 4, a current is applied for a short period under the condition of current i1 and pressurizing force P1 which are equal to or higher than the condition when a junction process is performed, and contact resistance is reduced. The monitoring voltage read out by a voltmeter 11 is made to astringent to a constant voltage VS gradually, and the contact resistance at this time disappears to the extent wherein it is almost negligible. Accordingly, the quantity of heat applied to the interface to be jointed is stabilized at this time by switching to the ordinary junction current application of current i2 and pressurizing force P2, and the irregularity of individual junction is removed, thereby enabling to obtain excellent junction result in a stabilized manner.
Inventors:
MACHIDA KAZUMICHI
Application Number:
JP15193783A
Publication Date:
March 08, 1985
Filing Date:
August 20, 1983
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H05K3/32; H01L21/60; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
Masuo Oiwa