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Patent Searching and Data


Title:
VAPOR DEPOSITION DEVICE
Document Type and Number:
Japanese Patent JPS60116769
Kind Code:
A
Abstract:

PURPOSE: To avoid the interruption of an evaporation state, and to send only an evaporation material which is completely gassified to a material to be treated by providing a shielding plate in a vessel wherein the evaporation material is melted in a continuous vapor deposition device capable of supplying successively the evaporation material to an evaporation source.

CONSTITUTION: A belt-shaped material 1 to be treated is continuously supplied into a vacuum vessel in the direction (a), and the vecuum vapor deposition of Al is carried out. An Al chip 8 is thrown into a crucible 2 at the lower position of the material 1 to be treated, and the molten part is formed by heating with an electron beam 3 and further evaporated. A shutter 5 provided between an evaporation source 4 and the material 1 is closed until the evaporation of the Al becomes stationary to avoid the deposition of the evaporated material on the material 1 to be treated. The supply of the chip 8 into the crucible 2 is carried out by rotating a rotor 9, and the chip 8 charged into a hopper 7 is sent into the crucible. The vicinity of the position where the replenished chip 8 is melted is covered with a shielding plate 11 to prevent the deposition of the evaporated substance and the splash of Al, etc. on the material to be treated 1.


Inventors:
KOBAYASHI TSUNEKIYO
Application Number:
JP22608583A
Publication Date:
June 24, 1985
Filing Date:
November 30, 1983
Export Citation:
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Assignee:
SHINKO ELECTRIC IND CO
International Classes:
C23C14/24; (IPC1-7): C23C14/24
Domestic Patent References:
JPS6075574A1985-04-27
Attorney, Agent or Firm:
Takao Watanuki (1 outside)