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Title:
RESIN COMPOSITION FOR ADHESIVE
Document Type and Number:
Japanese Patent JPS59136367
Kind Code:
A
Abstract:

PURPOSE: The titled composition, consisting of an acrylic or methacrylic copolymer containing a specific amount of a specified comonomer and a specific bifunctional compound, having improved high-temperature creep characteristics and tackiness and long pot life, and suitable for liquid pressure-sensitive adhesives.

CONSTITUTION: A composition consisting of (A) an acrylic or methacrylic copolymer containing (i) 0.2W30wt% comonomer of formula I (R1 is H or methyl; R2 and R3 are H or 1W4C alkyl; n is an integer 1W4), preferably N,N-dimethylaminoethylmethacrylamide, and/or (ii) a comonomer of formula II (R4 is H or methyl; R5 and R6 are H, hydroxymethyl or alkoxymethyl having 1W4C alkyl part), preferably acrylamide, and (B) a bifunctional compound of formula III [R is a group of formula IV or -(CH2)m-; Hal is Cl, Br or I; m is an integer 0W10], preferably p-xylylene dichloride. The amount of Hal in the component (B) is 0.1W3 equivalents based on the groups of formulas V and VI in the component (A).


Inventors:
TANGE TOYOKICHI
Application Number:
JP1046983A
Publication Date:
August 04, 1984
Filing Date:
January 27, 1983
Export Citation:
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Assignee:
NIPPON CARBIDE KOGYO KK
International Classes:
C08F8/00; C08F8/24; C08F20/00; C08F20/34; C08F220/34; C08F220/56; C09J133/04; C09J133/06; (IPC1-7): C08F8/24; C08F220/34; C08F220/56; C09J3/14
Attorney, Agent or Firm:
Heiyoshi Odashima



 
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