Title:
POLISHING MATERIAL
Document Type and Number:
Japanese Patent JPH04101776
Kind Code:
A
Abstract:
PURPOSE: To enhance the adhesion, efficiency and uniformity of treatment of the coating by providing the grinds of a thermosetting resin mold 5-100 mesh in particle size.
CONSTITUTION: The polishing material is composed of the grinds of 5-100 mesh in particle size of a thermosetting resin mold. The adhesion to the metal surface prior to coating is thus improved and the peeling off of coated film is facilitated.
Inventors:
KONDO KENKICHI
Application Number:
JP21546490A
Publication Date:
April 03, 1992
Filing Date:
August 15, 1990
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
B24C11/00; C08J5/14; C08L61/20; C08L61/22; C09K3/14; (IPC1-7): B24C11/00; C08J5/14; C08L61/22; C09K3/14
Domestic Patent References:
| JPS6234779A | 1987-02-14 | |||
| JPS61152371A | 1986-07-11 | |||
| JPS61152370A | 1986-07-11 | |||
| JPH03287379A | 1991-12-18 |
Attorney, Agent or Firm:
Toshio Nishizawa