PURPOSE: To treat chips in size extending over a wide range by a frame of one kind by bonding a frame body consisting of ceramics or a heat-resistant organic matter with the nose section of an inner lead in a lead frame or one part of a die attachment.

CONSTITUTION: A frame body 7 composed of ceramics or a heat-resistant organic matter is mounted to the nose sections of inner leads 4 in a lead frame 1, a semiconductor chip 3 is arranged into the frame, and wires 5 are wire-bonded while crossing the frame body 7 fixed with heat-resistant adhesives 8 so as to surround a die attachment 2. Semiconductor chips in size extending over a wide range can be received in semiconductor packages of the same external shape by the lead frames of one kind having the large die attachments because long-span wires can be applied.