Title:
SUCTION CHUCK OF SEMICONDUCTOR WAFER
Document Type and Number:
Japanese Patent JPS6027142
Kind Code:
A
Abstract:
PURPOSE:To perform the reception and feed of wafers without the break of the wafers by a method wherein a wafer is placed on a detachable upper plate being put on a frame, and the wafer is then held by suction via plate by vacuum drawing in the frame. CONSTITUTION:The wafer 1 is taken out of a housing container and then placed on the suction plane 12a of the upper plate 12. Thus, the wafer 1 is transferred onto the plate 12 without being scratched or contaminated. The plate 12 loaded with the wafer 1 is put on the outer frame 10, which is then evacuated by a vacuum pump. Thereby, the plate 12 is fixed on the frame 10 by suction via O- ring 11, and the wafer 1 is held by close contact with the plane 12a by the action of negative pressure suction of each suction hole 12b. When processes such as the measurement of the wafer 1 are finished in this state, the vacuum suction is stopped, and the pressure in the frame 10 is made atmospheric pressure or over it by introduction of air and the like through a vacuum drawing port 14. Then, the plate 12 and the wafer 1 become freely detachable state.
Inventors:
ISAJI HIROSHI
Application Number:
JP13709883A
Publication Date:
February 12, 1985
Filing Date:
July 25, 1983
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L21/67; H01L21/68; H01L21/683; (IPC1-7): H01L21/68
Attorney, Agent or Firm:
Masuo Oiwa
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