Title:
RESIN FILM FORMATION FOR ELECTRONIC PARTS
Document Type and Number:
Japanese Patent JPS5848925
Kind Code:
A
Abstract:
PURPOSE:To reduce viscocity of resin solution and cover electronic parts with homogeneous film by vibrating them vertically within the thixotropic resin. CONSTITUTION:The liquid surface 17 of resin solution 16 is neated horizontally by driving the wiper 14 and the tank 12 is moved upward. When the liquid surface 17 comes close to electronic parts 4, the frame 13 is vibrated under the predicted conditions, and when parts 4 immersed into the solution 16 up to the specified depth, the tank stops movement. A part of the resin solution 16 surrounding the parts 4 vibrating together with the frame 3 absorbs the vibration energy of parts and thereby its viscosity is lowered. Therefore, when the tank 12 is moved downward and the parts 4 are pulled out of the liquid 16, the resin film 5 having the uniform thickness can be formed. In this case, film thickness can be controlled accurately by changing the number of vibrations.
Inventors:
KOBAYASHI MASAHIRO
MUNAKATA ICHIROU
MUNAKATA ICHIROU
Application Number:
JP14735581A
Publication Date:
March 23, 1983
Filing Date:
September 18, 1981
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H01C17/02; H01L21/56; (IPC1-7): H01C17/02
Attorney, Agent or Firm:
Koshiro Matsuoka