Title:
STRUCTURE FOR MOUNTING LIGHT EMITTING DIODE
Document Type and Number:
Japanese Patent JPS6012782
Kind Code:
A
Abstract:
PURPOSE:To contrive the access of the light emitting part of an LED to the end surface of an optical fiber by a method wherein the LED chip is mounted by the arrangement of the light emitting surface thereof in opposition to the photo penetration hole of a lead frame, and then the back surface electrode of the chip is connected to the lead frame, which are covered with a transparent resin. CONSTITUTION:A ring electrode 24 having the light emitting surface 26 of the LED chip 5 is made opposed to the hole 34 of the seat 33 of the lead frame 30 in a lead frame band linked by means of a tie-bar 32, and is then soldered to the seat 33, and the back surface electrode 23 is connected 7 to the lead frame 31. Sealing with transparent resin 14 is carried out by including the chip 5, connection 7, and all the tips of the lead frames 30 and 31. The light emission of the LED is released out of the hole 34 to the outer surface 35 of the resin 14. The distance (b) between the lead frame 30 and the outer surface 35 is determined in the minimum value on the basis of the mechanical properties of the resin. This structure enables the access of the light emitting surface 26 to the end surface of the optical fiber in 1.2-1.5mm., thus enhancing the coupling efficiency of the LED with the optical fiber.
Inventors:
SUGIMOTO TETSUO
Application Number:
JP12004483A
Publication Date:
January 23, 1985
Filing Date:
July 01, 1983
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
G02B6/42; H01L33/14; H01L33/30; H01L33/56; H01L33/62; H01S5/022; (IPC1-7): H01L33/00
Attorney, Agent or Firm:
Shigeki Kawase
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