Title:
【発明の名称】タングステン又はモリブデン半導体素子基板の製造方法
Document Type and Number:
Japanese Patent JPS5951740
Kind Code:
B2
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Inventors:
SAITO HIROYUKI
KOIZUMI HIDEO
FUKUHARA YOSHIO
KOIZUMI HIDEO
FUKUHARA YOSHIO
Application Number:
JP11929679A
Publication Date:
December 15, 1984
Filing Date:
September 19, 1979
Export Citation:
Assignee:
TOKYO SHIBAURA ELECTRIC CO
International Classes:
B24B31/02; H01L21/304; (IPC1-7): H01L21/304; B24B31/02
Attorney, Agent or Firm:
Hajime Tsukuni