Title:
METHOD FOR SEPARATING PLATES
Document Type and Number:
Japanese Patent JPS59130440
Kind Code:
A
Abstract:
PURPOSE:To keep the alignment of the wafers in order and to facilitate automation in the following process such as die bonding by sticking an adhesive sheet to back surface of the wafer and performing the operation in handling after dicing through the ahesive sheet. CONSTITUTION:An adhesive sheet 2 is stuck to back surface of a semiconductor wafer 1. Handling holes 3 are arranged at the end portion of the adhesive sheet 2 in order to facilitate transportation, storage and control. As the adhesive sheet 2 is stuck to back surface of the wafer 1, depth of a groove A made by dicing can be made as deep as possible. After dicing, the wafers are detached from a table and bars 6 are inserted into the holes 3, thereby putting the wafers into a strip, which are immersed in cleaning fluid 7. Clamp projections 10 of a spinner rotary plate 9 are fitted in the handling holes 3 of the adhesive sheet 2 and the wafer is rotated to be dried. The semiconductor wafer 1 being stuck the adhesive sheet 2 is pushed up mechanically with a thrust-up pin 13 from lower surface of the sheet 2 and the semiconductor pellt 1a is picked up by a collet.
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| JPS60140837 | ROTARY CARRYING DEVICE |
| JPS6020852 | STICKING METHOD OF WAFER |
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Inventors:
MIMATA TSUTOMU
KABASHIMA AKIRA
OZOEGAWA SUGURU
KABASHIMA AKIRA
OZOEGAWA SUGURU
Application Number:
JP22201383A
Publication Date:
July 27, 1984
Filing Date:
November 28, 1983
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L21/67; B28D5/00; H01L21/301; H01L21/78; (IPC1-7): B28D5/02; H01L21/68
Attorney, Agent or Firm:
Katsuo Ogawa