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Patent Searching and Data


Title:
TRANSFER MOLDING DEVICE
Document Type and Number:
Japanese Patent JPH0919939
Kind Code:
A
Abstract:

To contrive to shorten the molding processing time by a method wherein some part of or the whole recessed surface contacting with a molten resin except at least cavity surfaces are made into uneven surfaces.

In the transfer molding device equipped with a mold 1 having a recessed cull 5 for housing a molding resin material, recessed cavities 6 for forming molded articles, runners 7 and gates 8 for communicating the cull 5 with the cavities 6, some part of or the whole recessed surfaces contacting with a molten resin except at least the cavities 6 are made into uneven surfaces 10 and 11. Thus, the hardening time of the resin portion filled in the cull 5 part and the runner 7 parts is shortened, since the contact area between the resin in the cull 5 part and the runner 7 parts and a bottom mold 2 increases and consequently the interior of the resin reaches the polymerization temperature at the early point of time due to the uneven surfaces 10 and 11 provided at the bottom surfaces of the cull 5 and of the runners 7 and curving the runners 7.


Inventors:
HOSAKA SUKETSUGU
Application Number:
JP16942095A
Publication Date:
January 21, 1997
Filing Date:
July 05, 1995
Export Citation:
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Assignee:
HITACHI LTD
AKITA DENSHI KK
International Classes:
B29C33/42; B29C45/02; B29C45/14; B29C45/26; H01L21/56; B29L31/34; (IPC1-7): B29C45/02; B29C33/42; B29C45/14; B29C45/26; H01L21/56
Attorney, Agent or Firm:
Akita Aki