Title:
TRANSMISSION MODULE AND CIRCUIT BOARD USED FOR THE SAME
Document Type and Number:
Japanese Patent JP2016021469
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a transmission module capable of easily performing work such as firmware downloading and verification without needing a specialized tool, and a circuit board used for the same.SOLUTION: A transmission module 100 comprises: a substrate body 2 with insulation properties; a first card edge connector 3A provided in one end 2a of the substrate body 2; a second card edge connector 3B provided in the other end 2b of the substrate body 2; circuit elements such as a light-emitting element array 4, a light-receiving element array 5, a driver IC 6, and a preamplifier IC 7 mounted on the substrate body 2; a CPU 9 with a built-in memory mounted on the substrate body 2 and controlling the circuit elements; a first wiring pattern 32a formed on an upper surface 2d of the substrate body 2 and connecting an electrode 30 of the first card edge connector 3A and the CPU 9; and a second wiring pattern 32b formed on the upper surface 2d of the substrate body 2 and connecting an electrode 31 of the second card edge connector 3B and the CPU 9.SELECTED DRAWING: Figure 1
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Inventors:
OGURA AKIRA
YAMAZAKI KINYA
SATO MASAAKI
KOMATSUZAKI SHINJI
YAMAZAKI KINYA
SATO MASAAKI
KOMATSUZAKI SHINJI
Application Number:
JP2014144154A
Publication Date:
February 04, 2016
Filing Date:
July 14, 2014
Export Citation:
Assignee:
HITACHI METALS LTD
International Classes:
H01L23/12; H05K1/11
Attorney, Agent or Firm:
Tadao Hirata
Kenji Tsunoda
Yuji Iwanaga
Keiko Nakamura
Endo Wako
Takashi Nomiyama
Hiroyuki Ito
Kenji Tsunoda
Yuji Iwanaga
Keiko Nakamura
Endo Wako
Takashi Nomiyama
Hiroyuki Ito