Title:
TRANSPARENT CONDUCTIVE ADHESIVE, LAMINATE, AND SUBSTRATE JOINING METHOD
Document Type and Number:
Japanese Patent JP2017141328
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a transparent conductive adhesive that makes it possible to join substrates together while meeting both high conductivity and high translucency.SOLUTION: A transparent conductive adhesive has a transparent resin adhesive of 100 pts.wt., and conductive spherical particles of 0.5-30 pts.wt. The conductive spherical particles have a particle size distribution with D90/D10 of 3.0 or less, the D90/D10 being the ratio of volume-based D90 particle diameters to volume-based D10 particle diameters.SELECTED DRAWING: Figure 1
Inventors:
YOSHIKAWA JUN
KONDO KOICHI
KONDO KOICHI
Application Number:
JP2016022187A
Publication Date:
August 17, 2017
Filing Date:
February 08, 2016
Export Citation:
Assignee:
NGK INSULATORS LTD
International Classes:
C09J201/00; B32B7/02; B32B7/12; C09J7/02; C09J9/02; C09J11/08; H01B1/00; H01B1/22
Attorney, Agent or Firm:
Masaharu Takamura
Hiroki Kashima
Hiroki Kashima
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