To provide a tray for a wiring board with leads, which accommodates the wiring board having a plurality of lead terminals attached on one long side of an oblong insulating board to project laterally from the insulating board, while preventing scratches on the lead terminals resulting from abrasion between the lead terminals and a tray surface.

The tray consists of a board member 1 which is stacked in tiers and has a recession 3 on its upper surface, in which the wiring board 2 having the lead terminals 5 attached on one long side of the oblong insulating board 4 to project laterally from the insulating board 4 is accommodated. The recession 3 has first projections 3a on its bottom face, where the projections 3a supports the lower surface of the insulating board 4 so that the lead terminals 5 are located at a level between the bottom face and the upper end of the bottom face of the recession 3. The recession 3 also has second projections 3b on its back face, where the projections 3b make contact with the upper surface of another insulating board 4 at the lower side tier. When a plurality of board members 1 are stacked in tiers, each wiring board 2 with the lead is accommodated in each recession 3 with the lead terminals 5 suspended in a space inside the recession 3.