TREATING DEVICE AND METHOD

Japanese Patent JP3239981

B2

PROBLEM TO BE SOLVED: To obtain a device for recognizing not only the presence or absence of a substrate to be treated on a mount body and but also such abnormality as the overlapped retention of the substrate to be treated by providing a means for detecting the displacement of the retention body for pressing the peripheral edge portion of the substrate to be treated against the mount body.
SOLUTION: A substrate W to be treated is mounted on a mount body and at the same time the substrate W to be treated is subjected to a specific treatment while the peripheral edge portion of the substrate W to be treated is retained by retention body 27 which can be pressed against the mount body. Such a treatment device has a means 43 for detecting the displacement of the retention body 27. For example, a rotary plate 9 with the mount body for mounting a plurality of substrates W to be treated in peripheral direction is provided in a lid body 11 for opening and closing a treatment room 8, the retention body 27 is provided at a rotary plate 9, and at the same time an operation plate which is linked to the retention body 27 is provided at the reverse side of the rotary plate 9. Then, the lid body 11 has a displacement detection means 43 consisting of an eddy current sensor for detecting the displacement of the operation plate.

Katsuto Hirose

JP29746995A

December 17, 2001

October 20, 1995

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東京エレクトロン株式会社
バリアンセミコンダクターイクイップメント株式会社

C23C14/48; B23Q17/00; H01L21/205; H01L21/22; H01L21/265; H01L21/3065; H01L21/31; H01L21/68; H01L21/683; (IPC1-7): H01L21/68; B23Q17/00; H01L21/265

JP6249966A
JP479043U
JP219440U

Noriyuki Kanesaka

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