Title:
TREATING DEVICE
Document Type and Number:
Japanese Patent JP3120666
Kind Code:
B2
Abstract:
PURPOSE: To provide a treating device capable of conducting uniform treatment in the plane of a wafer.
CONSTITUTION: An aluminum film 20 is arranged between an upper seal plate 11 to be impressed with a high-frequency wave from a high-frequency power source 16 and an upper electrode 17 fixed on the lower face of the upper seal plate 11. A lower electrode 24 is opposed to the upper electrode 17 at an interval. The high-frequency wave is sufficiently propagated between the upper seal plate 11 and the upper electrode 17 through the aluminum film 20, and uniform treatment is applied in the plane of a wafer.
Inventors:
Tomohiko Ogasa
Application Number:
JP25984094A
Publication Date:
December 25, 2000
Filing Date:
September 30, 1994
Export Citation:
Assignee:
Nippon Steel Tube Co., Ltd.
International Classes:
H05H1/46; C23C16/50; C23F4/00; (IPC1-7): C23F4/00; C23C16/50
Attorney, Agent or Firm:
Hanawa Yoshio