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Patent Searching and Data


Title:
TREATING METHOD FOR END OF BONDED FORMED PRODUCT
Document Type and Number:
Japanese Patent JPS57193315
Kind Code:
A
Abstract:

PURPOSE: To reduce the number of steps in a treating method for the end of a bonded formed product and to improve the external appearance of the product by forming the folded part of a resin core material, simultaneously cutting the trim of the folding margin of the outer periphery of a surface material to be bonded onto a core material with dies.

CONSTITUTION: An upper die 4 is moved down, and core material/surface material 1, 2 are compressed and formed between the projected surface 3a of a lower die 3 and the recess surface 4a of the die 4. At this time, a slide die 6 is moved from the side toward an auxiliary die 5, the excessive ends of the core material/ surface materials 1, 2 are cut and removed by the shoulder part 6a and the edge 5a of the die 5. When the die 6 is further moved, the intermediate part between the folded part a of the material 1 and the outer end b of the material 1 are cut by the projection 3c of the die 3. Subsequently, the end b of the material 1 is isolated from the back surface of the end of the material 2, thereby forming a desired folded part 3c at the end side of the folded part a with the material 2.


Inventors:
KOMATSU HARUO
Application Number:
JP7827281A
Publication Date:
November 27, 1982
Filing Date:
May 23, 1981
Export Citation:
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Assignee:
KASAI KOGYO KK
International Classes:
B26D11/00; B29C53/00; B29C53/04; B29C63/04; B29C65/00; B29C65/02; (IPC1-7): B29C17/10; B29C27/00