To provide an ultrasonic signal processing device capable of measuring precisely the thickness of a test subject or the like.
In this ultrasonic signal processing device for emitting an ultrasonic wave to the test subject, and measuring the thickness of the test subject based on a vertical sensor signal detected by a vertical sensor, a vertical sensor parent metal inner surface detection device 2 detects the position of the test subject inner surface based on the vertical sensor signal acquired from the vertical type sensor. A corrected section C scope display device 3 displays a section image including the position of the detected test subject inner surface. A parent metal outer surface detection device 4 detects the position of the test subject outer surface from the section image. A parent metal thickness calculation device 11 calculates the thickness of the test subject by using the detected position of the test subject outer surface.
KUROKAWA MASAAKI
WAKU MASAO
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