Title:
電気工学または電子工学部品の注型材料としてのシリコーン変性エポキシ樹脂の使用
Document Type and Number:
Japanese Patent JP4138001
Kind Code:
B2
Abstract:
PCT No. PCT/DE96/00993 Sec. 371 Date Jun. 10, 1998 Sec. 102(e) Date Jun. 10, 1998 PCT Filed Jun. 5, 1996 PCT Pub. No. WO97/02321 PCT Pub. Date Jan. 23, 1997The use of a thermosetting epoxy resin blend as a casting compound for electronic or electrotechnical components. The blend contains a silicone-modified epoxy resin in which organic components containing epoxy groups are chemically bonded to silicone components, and a mineral filler, optionally silanized, that regulates the thermal expansion behavior, in an amount of 40 wt % to 75 wt %, based on the thermosetting epoxy resin blend. The thermosetting epoxy resin blends are used to particular advantage for casting diodes.
Inventors:
Werner Pfunder
Irene Jenrich
Richard Spitz
Uwe Koehler
Siegfried Schueller
Irene Jenrich
Richard Spitz
Uwe Koehler
Siegfried Schueller
Application Number:
JP50468697A
Publication Date:
August 20, 2008
Filing Date:
June 05, 1996
Export Citation:
Assignee:
ROBERT BOSCH GMBH
International Classes:
H01B3/40; C08G59/20; C08G59/30; C08K3/00; C08K3/013; C08K9/06; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
| JP5226700A | ||||
| JP5302033A | ||||
| JP63202616A | ||||
| JP63095222A | ||||
| JP61271319A |
Attorney, Agent or Firm:
Toshio Yano
Toshiomi Yamazaki
Takuya Kuno
Reinhard Einsel
Toshiomi Yamazaki
Takuya Kuno
Reinhard Einsel