Title:
VACUUM PINCETTE
Document Type and Number:
Japanese Patent JPS58132945
Kind Code:
A
Abstract:
PURPOSE:To facilitate the handling of a wafer positioned on a flat surface without inflicting damages upon wafer surface through use of vacuum pincette. CONSTITUTION:A wafer 1 is arrested by a vacuum adsorbing section 3. Surrounding the wafer 1 is an approximately 5mm.-thick ring to be vacuum-adsorbed. Located inside is a vacancy 2 open to the atmosphere via a hole 6. The pressure inside the wafer 1 being equivalent to the atmosphere outside, the wafer 1 is free from bending even when the wafer 1 is vacuum-chucked. A vacancy 5 is a right-shaped vacuum communicating with a vacancy 3 via a fine hole 4. The vacancy 5 communicates with an externally located vacuum control unit via a path running through a vacuum chuck handle 9. The outermost circumference of the vacuum pincette main body 7 is slightly convex for the guidance of a wafer in a process of vacuum-chucking.
Inventors:
TERAJIMA SEIJI
Application Number:
JP1565882A
Publication Date:
August 08, 1983
Filing Date:
February 03, 1982
Export Citation:
Assignee:
SUWA SEIKOSHA KK
International Classes:
H01L21/677; H01L21/683; (IPC1-7): H01L21/68
Attorney, Agent or Firm:
Top affairs