Title:
VACUUM TREATMENT APPARATUS AND VACUUM TREATMENT METHOD
Document Type and Number:
Japanese Patent JP2023071282
Kind Code:
A
Abstract:
To provide a vacuum treatment apparatus that improves productivity, and to provide a vacuum treatment method.SOLUTION: A vacuum treatment apparatus includes a cylindrical sputtering target, a magnetic field generating mechanism, a control device and a vacuum vessel. The sputtering target includes: a first principal surface for emitting sputtering particles; and a second principal surface located on an opposite side to the first principal surface. The magnetic field generating mechanism includes a plurality of magnetic circuit parts arranged in parallel in one axial direction while being opposite to the second principal surface and is configured to be capable of changing a position of a magnetic flux generated from a pair of magnetic circuit parts disposed at both ends in the one axial direction in the plurality of magnetic circuit parts. The control device controls the position of the magnetic flux to divert a discharged plasma, which is formed while being opposite to the first principal surface, to ends of the sputtering target. The vacuum vessel accommodates the sputtering target and the magnetic field generating mechanism.SELECTED DRAWING: Figure 1
Inventors:
ORII YUICHI
TACHIKAWA SHINSUKE
TAKAGI DAI
ONO TETSUHIRO
HAKOMORI MUNEHITO
NISHINOBO YASUKI
SAITO KAZUHIKO
SUDA TOMOKAZU
TACHIKAWA SHINSUKE
TAKAGI DAI
ONO TETSUHIRO
HAKOMORI MUNEHITO
NISHINOBO YASUKI
SAITO KAZUHIKO
SUDA TOMOKAZU
Application Number:
JP2021183948A
Publication Date:
May 23, 2023
Filing Date:
November 11, 2021
Export Citation:
Assignee:
ULVAC CORP
International Classes:
C23C14/35
Attorney, Agent or Firm:
Patent Attorney Corporation Minami Aoyama International Patent Office
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