To provide a vacuum-processing device which is capable of uniformly improving adhesion of a processed substrate to a support plane and processing the substrate.
In a plasma processing device, a support surface 15 of a plate 14, which supports and heats a glass substrate 18 as a processed substrate, is curved convex so as to form a part of the outer surface of a column. A frame 16 is curved to have substantially the same radius of curvature as with the support surface 15. In a state where the glass substrate 18 is pinched between the support surface 15 and the frame 16, the glass substrate 18 is curved along the support surface 15. With this setup, the glass substrate 18 is arranged which comes into close contact with the support surface 15 without producing gaps, so that uniform plasma treatment can be carried out.
SASAGAWA EISHIRO
KANZAKI JUNICHI
NISHIMURA TOSHIMICHI
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