To provide a vapor deposition apparatus capable of controlling the side wall shapes of metallic wirings.

A crucible 108 in which a vapor deposition source M is housed is arranged in a position deviating from the center 106 of rotation of a planetary 104 on which plural wafers W are mounted and which rotates. Further, a guard plate freely rotatable around the axis 110a of rotation approximately parallel with the axis of rotation of the planetary is disposed apart a prescribed spacing from the crucible 108. The amt. of the vapor deposition particles P of a large incident angle toward the part which is the shadow of this guard plate is adjusted by adjusting the rotating angle of the guard plate, by which the shapes of the wiring side walls is controlled.