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Patent Searching and Data


Title:
VAPOR DEPOSITION SOURCE, VACUUM DEPOSITION APPARATUS AND VACUUM DEPOSITION METHOD
Document Type and Number:
Japanese Patent JP2010013693
Kind Code:
A
Abstract:

To increase productivity, and to stably control a vapor deposition rate by improving the uniformity of heating of a vapor deposition material.

The vacuum deposition apparatus 1 sublimes or evaporates the vapor deposition material by heating it to vapor-deposit the material on a substrate 9 in a vacuum chamber 2. In the apparatus, an organic material as the vapor deposition material is carried on a porous body having a melting point higher than that of the organic material and also having a thermal conductivity higher than that of the organic material, and the organic material carried on the porous body is used as a vapor deposition source 3.


Inventors:
FUJIKAWA KAZUKO
YO MANKICHI
Application Number:
JP2008174104A
Publication Date:
January 21, 2010
Filing Date:
July 03, 2008
Export Citation:
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Assignee:
SONAC KK
International Classes:
C23C14/24; C23C14/12
Attorney, Agent or Firm:
Kazuhide Okada