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Title:
WAFER BOAT CARRYING JIG
Document Type and Number:
Japanese Patent JPH03295226
Kind Code:
A
Abstract:

PURPOSE: To lower the temperature in a chuck part for restraining the thermal expansion and reducing the position slip or deflection thereby avoiding the contact.collision accident by a method wherein radiating fins are provided between the chuck part and A boat holding part.

CONSTITUTION: A wafer boat jig 10 is composed of a wafer boat carrying jig main body and radiating fins 11. The main body is composed of Si impregnated SiC while the front end is formed into a holding part 12 holding a boat. The holding part 12 in plane-table type is to be inserted into the rear part of the wafer boat. The rear end is formed into a chuck part 13 to be held by the arm part of a shifting device. multiple radiating fins 11 are fixed on the intermediate part 14 between the holding part 12 and the chuck part 13. The chuck part 13 and the intermediate part 14 are hollow and cylindrical. The radiating fins ll made of Si impregnated SiC are bonded onto the wafer boat carrying jig main body using a bond material comprising organic base binder added Si powder.


Inventors:
NOZAWA TATSUO
TABEI TAKAHIRO
WATANABE YOSHIYUKI
Application Number:
JP9656790A
Publication Date:
December 26, 1991
Filing Date:
April 13, 1990
Export Citation:
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Assignee:
TOSHIBA CERAMICS CO
International Classes:
H01L21/22; H01L23/36; (IPC1-7): H01L21/22; H01L23/36
Attorney, Agent or Firm:
Toru Tanabe



 
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