Title:
ウエハ芯出し用器具
Document Type and Number:
Japanese Patent JP6564942
Kind Code:
B2
Abstract:
An alignment device for a wafer in an industrial process assembly includes an inner surface shaped to conform to an outer surface of a wafer, an outer surface comprising at least two cams; and two ends connecting the inner surface to the outer surface. The two ends are positioned such that when the alignment device is positioned on the outer surface of the wafer, the alignment device extends more than one hundred eighty degrees around the wafer.
Inventors:
Kenyon, Nathaniel, Kirk
Bingham, Bryce, Arthur
Stele, John, Henry
Bingham, Bryce, Arthur
Stele, John, Henry
Application Number:
JP2018515636A
Publication Date:
August 21, 2019
Filing Date:
September 15, 2016
Export Citation:
Assignee:
Dietrich Standard Incorporated
International Classes:
F16L1/00; G01F1/00; F16L23/02; G01D11/30; G01F15/18
Domestic Patent References:
| JP57122319A | ||||
| JP48073815A | ||||
| JP11511848A | ||||
| JP58057587A | ||||
| JP48082420A | ||||
| JP2002106737A |
Foreign References:
| CN204437704U | ||||
| EP1186867A1 | ||||
| US3643983 | ||||
| US20150130139 |
Attorney, Agent or Firm:
Kiyotaka Sakamoto
Sanji Tanabe
Sanji Tanabe