Title:
ウエハ洗浄の方法および装置
Document Type and Number:
Japanese Patent JP7457004
Kind Code:
B2
Abstract:
The present invention relates to a method for treating the surface of a wafer with multiple liquids, comprising rotating the surface of the wafer and discharging different liquid streams onto the rotating surface in a sequence from separate outlets, wherein the discharge of liquid streams which are contiguous in the sequence overlaps during a transition phase, and wherein during the transition phase the liquid streams merge after exiting said outlets to form a merged liquid stream before impacting the rotating surface. The invention also provides a liquid dispensing device incorporating a housing holding two or more liquid delivery tubes, wherein the tubes' outlets are inwardly angled towards one another, such that in use liquid streams delivered from the outlets of the two or more liquid delivery tubes merge to form a merged liquid stream.
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Inventors:
Zemmellock Christoph
Tutindale Urich
Selmer Reinhard
Estelle Walter
Tutindale Urich
Selmer Reinhard
Estelle Walter
Application Number:
JP2021513833A
Publication Date:
March 27, 2024
Filing Date:
September 16, 2019
Export Citation:
Assignee:
LAM RESEARCH AG
International Classes:
H01L21/304; B05B7/08; B05C11/08; B08B3/02
Domestic Patent References:
| JP2018116977A | ||||
| JP2019511125A |
Foreign References:
| US20040000322 |
Attorney, Agent or Firm:
Patent Attorney Corporation Meisei International Patent Office